报告人：美国科罗拉多大学波尔得分校  肖建亮博士

题目：Mechanics of Stretchable and Smart Electronics

时间：2015年6月3日(星期三) 上午09:30-11.00

地点：综合1号实验楼602

Mechanics of Stretchable and Smart Electronics

Jianliang Xiao

University of Colorado Boulder

 Abstract

Stretchable electronics combines the electronic performance of conventional wafer-based semiconductor devices and mechanical properties of a rubber band, and thus can have very broad applications that are impossible for hard, planar integrated circuits that exist today. Examples range from surgical and diagnostic implements that integrate with the human body to provide advanced therapeutic capabilities, to structural health monitors and inspection systems for civil engineering. In the first part of this talk, I will introduce our recently developed artificial compound eye with designs inspired by arthropod eyes. This artificial compound eye can achieve wide-angle field of view, low aberrations, high acuity to motion and an infinite depth of field, which were not possible through conventional technology. Mechanics, materials and optics of this system will be discussed. Secondly, I’ll talk about our recent work on time and temperature dependent evolution of buckled silicon thin films on shape memory polymers. By utilizing the capability of memorizing distinct shapes of shape memory polymers, this study can lead to smart, stretchable electronics that is responsive to environmental stimulations.

Bio:

Jianliang Xiao is an Assistant Professor in the Department of Mechanical Engineering at University of Colorado Boulder. Before joining CU-Boulder, he was a Postdoctoral Research Associate in Prof. John Rogers’ group at the Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign. He obtained his Ph.D. degree in Mechanical Engineering in 2009 from Northwestern University, under the supervision of Prof. Yonggang Huang. His B.S. and M.S. degrees were both from Tsinghua University in 2003 and 2006, respectively. His research interests include stretchable/flexible electronics, nanomaterials, soft materials and thin films.